聚醚醚酮 (PEEK)
KetaSpire® KT-851 NT
Manufacturer：无
延展性，耐疲劳性
Recorded properties
Record date：2026-11-08
| Property | Value | Unit |
|---|---|---|
| Density | 1.3 | g/cm³ |
| Melt flow rate | 10.0 | g/10min |
| Tensile strength | 96.0 | MPa |
| Tensile modulus | 3850.0 | MPa |
| Elongation at break | 25.0 | % |
| Flexural strength | 152.0 | MPa |
| Flexural modulus | 3620.0 | MPa |
| Notched impact strength | 7.5 | kJ/m² |
Test standard, specimen condition and source rights are not fully recorded. Values are for preliminary screening only; verify with the manufacturer before design or purchasing decisions.
Grade handling information to verify
The information below was automatically extracted from a material PDF and has not been individually reviewed. It is for preliminary reference only. Verify the exact grade’s manufacturer processing instructions, safety data sheet and equipment procedures before production; do not use candidate values directly as machine settings.
Matched by original PDF filename
- Storage
- Review the source for packaging, storage and opened-package instructions.
- Drying
- Candidate injection-molding recommendations: temperature 150 °C; time 4 h. Verify the source, grade and conditions.
- Equipment setup
- Candidate injection-molding recommendations: mold temperature 175 - 205 °C. Verify the source, grade and conditions.
- Applications
- Candidate application areas in the source: electrical and electronics. Verify the source, exact use and applicable approvals.
Source: the matched material PDF; page numbers refer to the original PDF.
- Drying temperature：page 1
- Drying time：page 1
- Mold temperature：page 1
- Application areas：page 2
