Industry Application

Semiconductor

Providing nano-level temperature control precision through metal 3D printed cold plates for wafer fabrication and lithography equipment.

Core Industry Pain Points

Plasma etching generates massive local heat, causing uneven wafer temperatures and yield drops.

Semiconductor cooling uses UPW, which easily corrodes traditional metal pipes and contaminates wafers.

High-end equipment is incredibly dense, unable to accommodate bulky traditional cooling modules.

3D printed complex internal channels achieve wafer surface temperature fluctuations of less than ±0.1°C.

Seamless forming avoids particle shedding from welding, perfectly compatible with UPW.

Extreme temperature uniformity guarantees wafer yield, while the integrated design reduces assembly complexity.

Temp Accuracy

±0.1°C

Cleanroom

Class 1

Part Reduction

80%

Industry Compliance

SEMI Standards

ISO 14644

RoHS