Industry Application

Liquid Cooling

Breaking machining limits with SLM 3D printing to manufacture micro-channel liquid cooling modules with extreme surface area.

Core Industry Pain Points

CNC can only create straight channels, failing to realize complex 3D conformal cooling around heat sources.

Traditional multi-part cold plates rely on O-rings which age and present catastrophic leakage risks over time.

As chip power surges, traditional cold plate surface areas cannot meet cooling demands, causing thermal throttling.

3D printing 0.5mm micro-channels to increase surface area by 300%. Zero assembly means zero leak risk.

Utilizing mathematically generated complex biometric lattice structures to achieve near-perfect fluid heat exchange.

Through metal AM, we leverage the "complexity is free" advantage to solve your worst thermal bottlenecks.

Thermal Res. Drop

60%

Surface Area Up

300%

Leakage Rate

Industry Compliance

ISO 9001

RoHS

100% Leak Tested